According to the press release, “Vicor Corporation today announced the introduction of Power-on-Package modular current multipliers for high performance, high current, CPU/GPU/ASIC (“XPU”) processors. By freeing up XPU socket pins and eliminating losses associated with delivery of current from the motherboard to the XPU, Vicor’s Power-on-Package solution enables higher current delivery for maximum XPU performance.”
And it continued, “In response to the ever-increasing demands of high performance applications — artificial intelligence, machine learning, big data mining — XPU operating currents have risen to hundreds of Amperes. Point-of-Load power architectures in which high current power delivery units are placed close to the XPU, mitigate power distribution losses on the motherboard but do nothing to lessen interconnect challenges between the XPU and the motherboard. With increasing XPU currents, the remaining short distance to the XPU — the “last inch” — consisting of motherboard conductors and interconnects within the XPU socket has become a limiting factor in XPU performance and total system efficiency.”
And also commented that, “Over the past ten years Vicor has pioneered 48V Direct-to-XPU power development, reducing losses by an average of 25% every two years, while increasing power system density and cost-effectiveness. The MCM-MCD ChiP-set introduced today continues that evolution. By overcoming the obstacles imposed on XPUs by external high current delivery through the “last inch”, Vicor’s Power-on-Package technology does more than just improve performance and simplify motherboard design — it enables XPUs to achieve previously unattainable performance levels that are necessary to fulfilling the promise of Artificial Intelligence.”