According to a recent press release, “Wave Computing®, the Silicon Valley start-up that is revolutionizing artificial intelligence (AI) and deep learning from the cloud to the edge with its dataflow-based systems and licensable IP solutions, today announced a strategic collaboration with Broadcom Inc. The companies will collaborate to bring Wave’s next-generation dataflow processing unit (DPU) to market at the leading-edge 7nm process node. The next generation DPU, which will continue to be the foundation of the company’s revolutionary AI system solutions, will be manufactured on TSMC’s 7nm process technology and leverage Broadcom’s industry-leading design platform, productization skills, and proven 7nm 56Gbps and 112Gbps SerDes that are ideally suited for high-performance deep learning applications.”
The release goes on, “Leveraging Broadcom’s best-in-class semiconductor design and implementation skills, experience in packaging and testing, and established 7nm physical Intellectual Property (IP) platform, Wave will extend its industry-leading offering of faster, more intelligent dataflow-based deep learning systems with minimal risk to schedule and cost. Wave Computing’s next generation DPUs will combine the company’s revolutionary dataflow architecture with its MIPS® 64-bit multi-threaded core technology and TSMC’s 7nm manufacturing process to accelerate the performance and power efficiency of its AI solutions for edge applications. In addition, the processors will incorporate Broadcom’s advanced physical IP to further enhance Wave’s AI systems performance and capacity, which are critical for large, machine learning datasets.”
Read more at Nasdaq.
Photo credit: Wave Computing